Higher Heat-Resistance Insulation Polyimide Film 6051

Higher Heat-Resistance Insulation Polyimide Film 6051

Higher warmth resistance 6051 insulation polyimide film 
6051 polyimide film is synthesized by polymerizing PMDA and ODA in sturdy polar solvents by means of the process of forming film and imines treatment method at large temperature.
Polyimide movie Features and Apps:
– Class H insulation (one hundred eighty degree)
– Outstanding bodily, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low & substantial temperature resistant. It performs effectively in the broad assortment of temperature as minimal as -452F (-269 degree) and as higher as +500F (+260 diploma). Because of its distinctive outstanding homes, it is the best selection amid numerous apps.
– Utilized in versatile prinyed circuits and as insulating materials of flat electrical cables, electromagnetic wires and motors.
Available: In rolls, in strips
 

Technological innovation Knowledge of 6051 polyimide movie

NO

Index Description unit index value
1 Density g/cm3 1.38~1.43 
2 Contraction rate,longitudinal and horizontal 150°c-400°c % <1.0
<3.0
3 Surface resistively,200°c Ω >1.*1013
four volume resistively,200°c Ω.m >1.*1571
5 Relative Dielectric factor constant 48-62HZ three.5±0.four
six Media Loss Factor 48-60HZ <4.0*10-3
7 Long-term Thermal Resistant <4.0*10-3
eight Temprature Index >180

 
 

Higher Heat-Resistance Insulation Polyimide Film 6051

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